Scientist/Senior Scientist - Far Beol Module, Ime

Candidate will be part of Far-Backend Of Line (Far-BEOL) team of process module engineers, advancing specialty microelectronics technologies at IME. His or her main roles and responsibilities include:- Develop and support bonding process capabilities, including vacuum bonding, metal-metal bonding, fusion bonding, hybrid bonding, and temporary bonding for MEMS, silicon photonics, and advanced packaging applications.- Deliver innovations involving process methodologies, materials, or approach, and generate intellectual property related to various aspects of wafer-to-wafer and die-to-wafer bonding.- Participate in discussions with industry partners to align and develop the building blocks required for next generation advanced packaging platforms, including equipment capabilities.- Participate as team member with process integration teams to actively support bonding process optimization and process troubleshooting for various industry and grant projects.- Support preparation of competitive grant research project proposals and execution of these projects.- File patents/know-hows on new development activities.- Publish research findings in prestigious journals and conferences.Job Requirement:- PhD with specialization in Electronic / Microelectronics / Material Engineering / Material Science/ Chemistry / Physics or equivalent.- 10 years of experience in wafer bonding technologies, either in an academic or industrial setting.- Prior hands-on experience in wafer bonding with in-depth technical knowledge in atleast one or more bonding processes and mechanisms (vacuum bonding, metal-metal bonding, fusion bonding, hybrid bonding, temporary bonding) is required.- Knowledge of MEMS, silicon photonics, or advanced packaging technology platforms is preferred.- Strong experimental design (DOE) and data analysis skills is preferred- Good interpersonal skills and strong demonstrated skills in collaborating with internal and external stakeholders.- At least 2 years of demonstrated experience in managing projects of moderate complexity is preferred- Good oral and written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.- Self-driven with strong interest in next-generation applications of wafer bonding technologies and industry trends.Company information Registration No.T08GB0002CReport this job advert Don't provide your bank or credit card details when applying for jobs.Researching careers? Find all the information and tips you need on career advice.#J-18808-Ljbffr